Thermal Solution for
AI SERVERS
AI Servers: Increasing Power and TIM Demands
GPU power consumption of AI servers keeps increasing. Air‑cooling solutions are prone to thermal throttling and excessive energy consumption. Cold‑plate liquid cooling has become the mainstream for intelligent computing clusters, while immersion liquid cooling is applied for ultra‑high‑computing‑power scenarios. Pain points including high heat flux density and high interfacial contact thermal resistance drive the iteration of high‑performance thermal interface materials (TIMs).
Chip-level
Die to IHS thermal interface
Chip-level
Die to IHS thermal interface
Board-level
Package to heat sink thermal interface
Application Pain Points
☑ Increasing Power Consumption
☑ Limited heat dissipation space
☑ Long-term Reliability
Techinno Thermal Management Solution
▏Recommended Products for Cold Plate Liquid Cooling
Thermally Conductive Phase Change Materials Fill‑PCM 800/Thermally Conductive TPM Fill‑TPM 800
Product Features
☑ Low thermal resistance
☑ Silicone-free, no contamination
☑ Natural tackiness
☑ High reliability
☑ Re-workable & easy handling
▏Recommended Products for Immersion Liquid Cooling
Liquid Metal Sheet Fill‑LM SP5000/Fill‑LM SP8000
Product Features
☑ Extremely high thermal conductivity
☑ Ultra-low thermal resistance
☑ High reliability, no pump out/dry out in long term application
☑ Safe and environmentally friendly, not volatile
▏Product Structure Diagram
Sample Application/ Price Inquiry
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