Phase Change Material (PCM) is designed to minimize thermal resistance between high power component and heat sink, and offers very stable thermal resistance to enhance the reliability of the device.

Fill-TPM Series is soft at room temperature and naturally tacky on the surface, providing excellent handling and reworking properties. This series has higher cohesion and self-healing ability, which can effectively prevent the large-size chips from warpage due to uneven heat generation, resulting in pump out.

Fill-Grease Series products have high thermal conductivity, low viscosity and good thixotropy. They can be applied on the substrate smoothly by stencil printing, screen printing or dispensing. Furthermore, they can wet the contact surface very well even under low mounting stress.

Fill-LM is a series of liquid metal composites made of liquid metal, polymer and thermally conductive fillers. It is used for the high power components to improve the reliability by providing extremely low thermal resistance. Liquid metal composite can fulfill the gaps and uneven surfaces of the interface, to form better contact and enhance the thermal conductive efficiency. Paste-like products have good thixotropy and are easy to be printed on the die or heat sink.

Fill-Pad is a kind of high-performance gap-filling thermally conductive material synthesized by a special process using resin-based material with metal oxides and other auxiliary materials, mainly designed to accommodate a wide gap range of the thermal interface between electronic devices and heat sinks or metal covers.

Techinno Fill-Gel is a family of paste-like material which is mixed with thermally conductive ceramic powder and silicone gel. These products are fully cured dispensable gels, requiring no mixing or curing.

T-Mask Series thermally conductive insulators are designed to provide low thermal resistance and excellent electrical insulation for high-power and high voltage applications. It has fiberglass or polyimide film as reinforced carrier for protecting the pad from tears, cut-throughs and punctures.

Fill-Hybrid is a composite functional electronic material that combines thermal conductivity and wave absorption. It can reduce thermal resistance by tiling the gaps between heat source and heat sink, just like thermally conductive gel; and it helps to reduce the cross-talk between chips by absorbing electromagnetic waves over a wider frequency range, and suppress harmonic interference within the enclosed cavity. While achieving thermal conductivity and wave-absorbing functions, it also has properties such as light weight, temperature and humidity resistance, low volatility, and low oil bleeding.

Fill-ESM are thermally conductive materials that store energy by absorbing or releasing heat during the phase change process, and the constant temperature of the phase change process allows for constant temperature thermal management. They have the advantages of high energy storage density, compact size, constant temperature control, significant energy saving effects, wide range of phase change temperature selection, and easy to control.

T-Plug is specifically engineered for high-frequency mating/unmating scenarios between optical transceivers and cages. The material autonomously fills micro-gaps during plug/unplug operations through solid-liquid phase change behavior. Electrically insulated versions are also available to meet electromagnetic compatibility (EMC) requirements for high-speed optical communication components.