Have you explored Techinno's high performance thermal solutions?
ABOUT TECHINNO
9 years of deep industry expertise with continuous innovation
9 Years of Trust
State-of-the-art manufacturing base ensuring abundant production capacity
6,000 m² Facility
Technical excellence validated by authoritative certifications
50+ Patents
Techinno Technology was founded in 2018 and acquired by Darbond in Jan 2025. We are dedicated to provide integrated thermal dissipation solutions from chips and system level, focus on developing, manufacturing and selling thermal interface material (TIM1.5&TIM2), composite liquid metal, , devoted to be the pioneer and leader of high-performance electronic materials. Our products include thermally conductive gap pad, thermally conductive insulator, thermally conductive single-component & double-component gel, thermally conductive grease, thermally conductive phase change and liquid metal materiales, which are widely used in telecommunications, data communication, automotive electronics, consumer electronic devices, industry, aerospace, defense, and medical equipment, etc.
SPOTLIGHT NEWS
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Techinno delivers full-scenario thermal interface material solutions for AI computing hardware.
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