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Have you explored Techinno's high performance thermal solutions?

High performance thermally conductive phase change material
High performance liquid metal material
PCM General Series/PCM Insulation Series
LM Liquid Series/LM Paste Series/LM Sheet Series
8 series of thermal pads, engineered for diverse applications
Gel Low Volatility Series/Gel General Series

Domain Controller Thermal Solution

High-end Laptop Thermal Conductive Solution

Optical Module Thermal Management Solutions

AI Server Thermal Conductivity Solutions

VR Thermal Conductivity Solutions

Thermal Conductivity Solutions for UAVs

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ABOUT TECHINNO

9 years of deep industry expertise with continuous innovation
9 Years of Trust
State-of-the-art manufacturing base ensuring abundant production capacity
6,000 m2 Facility
Technical excellence validated by authoritative certifications
50+ Patents

Techinno Technology was founded in 2018 and acquired by Darbond in Jan 2025. We are dedicated to provide integrated thermal dissipation solutions from chips and system level, focus on developing, manufacturing and selling thermal interface material (TIM1.5&TIM2), composite liquid metal, , devoted to be the pioneer and leader of high-performance electronic materials.

Our products include thermally conductive gap pad, thermally conductive insulator, thermally conductive single-component & double-component gel, thermally conductive grease, thermally conductive phase change and liquid metal materiales, which are widely used in telecommunications, data communication, automotive electronics, consumer electronic devices, industry, aerospace, defense, and medical equipment, etc.

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