Thermal Solution for
Switches
AI Switches: High Density and Thermal Demands
Driven by rapid AI iteration and surging computing power, data centers are stepping into high power density era. Network switches feature highly integrated onboard components including optical modules, power ICs and computing chips. Concentrated heat flux and limited PCB space bring severe thermal challenges, demanding high-performance board-level thermal management solutions.
Switch ASIC
Thermal interface between die and IHS
Switch ASIC
Thermal interface between die and IHS
Switch ASIC
Thermal interface between packaged device and heat sink /cold plate
Application Pain Points
☑ High heat flux & local hotspots on core ASIC chips
☑ Thermal warpage of large chips, poor interfacial contact
☑ Dense board-level heat sources, components of varying heights
☑ Stringent reliability for 7×24h operation
Techinno Thermal Management Solution
▏Recommended Products for Board-Level
Ultra-Soft Thermally Conductive Pads Fill-Pad US1200 / Fill-Pad US1400
Silicone-Free Thermally Conductive Pads Fill-Pad SF1000 / Fill-Pad US1600 / Fill-Pad US1800
Thermally Conductive Putty-Pad Fill-PT1200
▏Silicone-Free Thermally Conductive Pad
Fill-Pad US1600 Product Features
☑ Thermal conductivity: 16.0W/m-K
☑ Good surface wettability
☑ Good electrical insulation
☑ Low oil bleeding & low outgassing
☑ No siloxane volatiles
▏Product Structure Diagram
Sample Application/ Price Inquiry
For technical information / catalogue / application directions, please visit download center
