Thermal Solution for
Smart Vehicle Domain Controllers
Smart Vehicles: High Compute and Thermal Challenges
Smart vehicles are stepping into the high-computing era. Domain controllers integrate multiple high-power computing chips, featuring concentrated heat sources and limited cooling space. Complex vehicle operating conditions pose severe thermal control challenges. To prevent chip thermal throttling, extend the service life of electronic controls and meet strict automotive-grade reliability requirements, targeted thermal solutions for domain controllers are critical to vehicle thermal design.
Domain controller internal chips
Domain controller internal chips

Application Pain Points
☑ Concentrated heat sources, high local heat flux
☑ Variable gaps & complex assembly tolerances
☑ Vehicle temperature cycling and continuous vibration
☑ Must meet strict automotive-grade reliability
Techinno Thermal Management Solution
▏Recommended Products for AD Domain Controllers
Thermally Conductive TPM Fill‑TPM 800
Key Features
☑ Ultra-low thermal resistance
☑ Silicone-free
☑ High reliability
☑ Superior self-healing capability
☑ Soft texture, easy to install & reworkable


▏Recommended Products for Cabin Domain Controllers
Curable Thermally Conductive Gel Fill-CIP 2100
Product Features
☑ Thermal conductivity: 12.0W/m-K
☑ Easy for auto-dispensing
☑ Good surface wetting
☑ High compressibility for low stress applications
☑ Good long-term reliability

▏Product Structure Diagram

Sample Application/ Price Inquiry
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