Thermal Solution for

 Smart Vehicle Domain Controllers

Smart Vehicles: High Compute and Thermal Challenges

 

Smart vehicles are stepping into the high-computing era. Domain controllers integrate multiple high-power computing chips, featuring concentrated heat sources and limited cooling space. Complex vehicle operating conditions pose severe thermal control challenges. To prevent chip thermal throttling, extend the service life of electronic controls and meet strict automotive-grade reliability requirements, targeted thermal solutions for domain controllers are critical to vehicle thermal design.

 

 

 

Domain controller internal chips

Domain controller internal chips

Application Pain Points

☑ Concentrated heat sources, high local heat flux

☑ Variable gaps & complex assembly tolerances

☑ Vehicle temperature cycling and continuous vibration

☑ Must meet strict automotive-grade reliability

 

 

Techinno Thermal Management Solution

▏Recommended Products for AD Domain Controllers

Thermally Conductive TPM Fill‑TPM 800

Key Features

☑ Ultra-low thermal resistance

☑ Silicone-free

☑ High reliability

☑ Superior self-healing capability

☑ Soft texture, easy to install & reworkable

▏Recommended Products for Cabin Domain Controllers

Curable Thermally Conductive Gel Fill-CIP 2100

 Product Features

☑ Thermal conductivity: 12.0W/m-K

☑ Easy for auto-dispensing

☑ Good surface wetting

☑ High compressibility for low stress applications

☑ Good long-term reliability

▏Product Structure Diagram

Sample Application/ Price Inquiry

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For technical information / catalogue / application directions, please visit download center

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