Thermal Solution for Drones
Heat concentration and TIM Requirements
High-power lightweight UAV electronic controllers feature concentrated heat and endure altitude temperature cycling and continuous vibration. Mass production demands simple processing and cost control. The market requires thermal interface materials with low density, low thermal resistance, low outgassing, vibration resistance and automated-line compatibility.
Gimbal camera module (Bottom gimbal)
Gimbal camera module (Bottom gimbal)
Gimbal camera module (Bottom gimbal)
Flight control mainboard + Main controller / Video transmission chip
Flight control mainboard + Main controller / Video transmission chip
Application Pain Points
☑ Concentrated heat sources on ECUs, high local heat flux
☑ Light weight housing, variable tiny assembly gaps
☑ Wide temperature cycling & continuous flight vibration
☑ Low material density to minimize extra weight
☑ Low outgassing to protect RF & optical components
☑ Compatible with automated lines and cost control
Techinno Thermal Management Solution
▏Recommended Products
1. Thermally Conductive Gel Fill-Gel 600 / Fill-Gel 800 / Fill-Gel1000
2. Thermally conductive pad, ultra-soft series Fill-Pad US800
3. Thermally conductive pad, Silicone Free Series Fill-Pad SF800
Key Features
☑ Thermal Conductivity: 10.0W/m-K
☑ High reliability and thermal stability
☑ No post cure, easily for auto-dispensing
☑ Low siloxane content
☑ High compressibility for low stress applications
☑ Low contact resistance
☑ No pump-out, no crack/slide at thermal cycling and vibration environment
▏Product Structure Diagram
Sample Application/ Price Inquiry
For technical information / catalogue / application directions, please visit download center
