Thermal Solution for
Optical Modules
AI Optical Modules: Rising Power and Thermal Constraints
Driven by surging AI computing demands, the optical module market sees explosive growth. With rapid iteration of 800G/1.6T products, power consumption per module keeps rising, making the conflict between high power dissipation and limited heat dissipation space increasingly acute.
In-Module Application
Chip and optical component
Out-of-Module Application
Between optical module and cage
Application Pain Points
☑ Rising module power dissipation
☑ Minimal internal assembly gaps
☑ Pluggable structure risks material damage
Techinno Thermal Management Solution
▏Internal of module: Cured in Place Gap Filler Fill-CIP1120
Product Features
☑ Thermal conductivity up to 12.0 W/m·K
☑ Single-component post-curing formula, compatible with automated mass production
☑ Outstanding reliability and thermal stability
☑ Exceptional wettability
☑ Zero pump-out risk
▏External of module: Pluggable Thermally Conductive Composite T-Plug 820S
Product Features
☑ Excellent plug-and-wear resistance
☑ Low interfacial thermal resistance
☑ Superior electrical insulation performance
☑ Long-term high reliability
▏Product Structure Diagram
Sample Application/ Price Inquiry
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