Thermal Solution for VR
VR/AR Headsets: High Integration and Thermal Constraints
VR/AR all-in-one devices integrate optical and sensing components. High integration raises chip heat density; cavity heat buildup causes frame stuttering. Slim compact structures demand thermal interface materials with low stress, low outgassing and narrow-gap adaptability.
Between chip and heat sink
Between chip and heat sink
Between chip and heat sink
Optical module
Optical module
Optical module
Application Pain Points
☑ High local heat flux
☑ Thermal deformation & stress risk
☑ Outgassing contamination in enclosure
☑ Narrow-gap filling requirement
☑ Automated assembly & cost control
Techinno Thermal Management Solution
▏Recommended Products
1. Thermally Conductive Gels：Fill-Gel 600 / Fill-Gel 800 / Fill-Gel 1000
2. Thermally Conductive Pad：Fill-Pad US800
Fill-Pad US800 Key Features
☑ Thermal Conductivity: 8.0W/m-K
☑ Good surface wetting property
☑ Low compression force
☑ High compressibility
☑ Low oil bleeding
☑ Low outgassing
▏Product Structure Diagram
Sample Application/ Price Inquiry
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