Thermal Solution for Premium Laptops
Laptops: Slim Design and Thermal Constraints
High-end AI thin-and-light notebooks and gaming laptops pursue ultra-slim, high-performance designs. CPU/GPU produce high heat density under heavy loads. Heat accumulation in compact chassis triggers thermal throttling and performance limitations. Faster product iterations demand higher production efficiency, system stability and long-term reliability. Efficient thermal solutions are vital to unlock device performance and extend service life.
CPU
GPU
GPU
GPU
Application Pain Points
☑ High heat density on CPU/GPU
☑ Ultra-slim chassis with limited cooling gaps
☑ Stable material performance under long-term temperature cycling
Techinno Thermal Management Solution
▏Recommended Products
1. Thermally Conductive Phase Change Material Fill‑PCM800
2. Liquid Metal & Its Composite Material Fill-LM800
Fill-PCM 800 Key Features
☑ Low thermal resistance
☑ Silicone-free, no silicone contamination
☑ Natural surface tack
☑ Low viscosity
☑ High long-term reliability
☑ Good handling and reworkability
▏Product Structure Diagram
Sample Application/ Price Inquiry
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