New Launch | Techinno 18.0 W/m·K Silicone-Free Thermal Pad for High-Power Thermal Management
Background
AI compute demand is driving single-chip power toward the kilowatt level, with advanced packaging moving to larger sizes and high-density heterogeneous integration. AI servers, switches, and optical modules run 24/7. As power rises and space shrinks, TIMs must deliver high conductivity and low thermal resistance—plus low stress, low outgassing, and long-term stability. Silicone-free TIMs are gaining attention for long-cycle reliability and sensitive-device protection.
Why Silicone-Free
Silicone-free TIMs eliminate siloxane contamination risk at the source. Their modulus is tunable, enabling high conductivity with low-stress contact to protect BGA and flip-chip devices. They stay stable at high temperatures and meet long-term reliability requirements for high-end hardware.
The Challenge
Silicone-free systems face a trade-off: higher conductivity requires higher filler loading, which raises hardness and modulus and reduces interfacial contact—while ultra-soft low-modulus materials contact well but hit a conductivity ceiling. Techinno's Fill-Pad US1800 breaks this trade-off with 18.0 W/m·K conductivity and a silicone-free formula.
Fill-Pad US1800 Features
1. 18.0 W/m·K Ultra-High Conductivity
Rapidly moves heat away from the chip core, keeping board-level hardware stable at full load and reducing throttling and downtime risk. Thermal resistance drops as mounting pressure increases for better contact. Available in 0.5–5.0 mm thicknesses to match assembly gaps.
2. Soft and Self-Adhesive
Deforms easily under low pressure to fill gaps and absorb tolerances. Its natural tack and excellent wetting minimize air voids and interfacial resistance—no adhesive backing, so no added thermal resistance.
3. Low Residual Stress at High Temperature
Maintains suitable residual stress at high temperature for good interfacial contact and heat transfer. Low operating stress reduces solder-joint fatigue and PCB warpage—ideal for high-reliability, low-stress chip applications.
4. Silicone-Free for Long-Term Reliability
Silicone-free formula eliminates siloxane volatilization risk—suited to precision modules sensitive to siloxane outgassing. Validated through high-temperature aging, thermal shock, and 85°C/85%RH testing: stable thermal resistance, no significant conductivity decay. Low oil bleed and low volatilization prevent performance degradation over the product lifecycle.
Typical Applications
Servers, switches, optical modules; LCD, PDP and laser TV displays; automotive electronics and power batteries; industrial, LED lighting and power modules; HDDs and SSDs.
Closing
Techinno continues to advance thermal interface materials. Fill-Pad US1800 delivers balanced performance and reliable heat dissipation for high-end electronics. Contact us for samples or technical support.
