Techinno delivers full-scenario thermal interface material solutions for AI computing hardware.

As AI accelerators and high-performance compute nodes continue to scale, data centers are entering an era of unprecedented power density. Dense arrays of CPUs, GPUs, and optical transceivers leave minimal clearance between components, creating three critical thermal challenges:

Fueled by data centers, cloud computing and AI, high-speed optical modules (800G/1.6T/3.2T) are advancing toward higher bandwidth, smaller footprints and higher power density. This trend creates severe thermal challenges, raising strict requirements for premium thermal interface materials to avoid overheating and thermal failure.

As AI models scale up, computing power demand surges, driving 1.6T optical modules toward mass deployment and 3.2T+ products on the horizon. High-speed optical modules are vital for AI clusters, yet rising power densities and compact form factors intensify thermal challenges—especially with liquid cooling interfaces and repeated plugging cycles. Conventional thermal materials suffer wear, scraping, and failure under frequent insertion/removal, failing to meet high–heat-flux and high-durability requirements.

Booming AI and big data industries push chip power density higher, while conventional polymer-based thermal interface materials (TIMs) fail to cool high-power electronics effectively.

Fueled by AI, big data and 5G, automotive E/E architectures are evolving from distributed ECUs to centralized domain controllers and central computing platforms. ADAS domain SoCs process massive multi-sensor data and complex autonomous driving algorithms, leading to sharply elevated power density and heat generation, which creates tough thermal management bottlenecks.