Thermally Conductive Gel
Fill-Gel 1200
☑ Thermal Conductivity: 12.0W/m-K
☑ High reliability and thermal stability
☑ No post cure, easily for auto-dispensing
☑ No pump-out, no crack/slide at thermal cycling and vibration environment
Datasheet
FAQ
- What is Fill Gel 1200?
Fill‑Gel 1200 is one‑component no‑cure silicone thermal gel with 12.0W/m・K thermal conductivity. High‑thixotropy for low‑stress gap‑filling, good wetting & low thermal resistance, low‑volatility and reworkable. Working temperature:‑50℃ ~ 200℃, UL94 V‑0.
- What applications is Fill Gel 1200 suitable for?
It is used for communication equipment, data centers, optical modules, domain control units, smart terminals, mobile phones and tablets.
- What are its main key parameters?
Grey‑green color; density 3.2g/cm³; flow rate 25g/min; min bondline 0.2mm; dielectric strength ≥5kV/mm; volume resistivity ≥1.0×10¹³Ω・cm; dielectric constant 7.4@1MHz.
- What are package and storage conditions?
Packages:30cc‑600cc cartridge, 5‑gallon pail. Seal‑store at 0‑35℃, ≤65% RH, shelf‑life 12 months. Refer to MSDS for safety guidance.
