Thermally Conductive Phase Change Material
Fill-PCM 900/900SP
☑ Extremely low thermal resistance
☑ Silicone free, no silicone contamination
☑ Sheet products have natural tacky, stick on the surface of heat sink directly,no additional adhesive
☑ Paste-like products have low viscosity, easy to print
☑ High reliability, no pump out/dry out/crack/slump in long term application
☑ Good handling and reworkability
☑ Soft at room temperature, less stress on board during assembly
Datasheet
FAQ
- What is Fill PCM 900 Series?
Fill‑PCM 900 series is silicone‑free thermal phase‑change material, thermal conductivity 9.0W/m・K, phase‑change temperature 45℃. Sheet version is naturally tacky without extra adhesive; paste‑type 900SP features low viscosity for printing. Good reworkability, no pump‑out/dry‑out/crack/slump. Working temperature:‑40℃ ~ 125℃, UL94 V‑0.
- What applications is Fill PCM 900 Series suitable for?
It applies to CPU/GPU chipset, IGBT modules, memory modules, automotive electronics, TV and game consoles.
- What are its main key parameters?
Grey color; sheet thickness 0.15‑0.50mm; phase‑change temperature 45℃; min bondline 40μm; density:3.3g/cm³(900), 3.0g/cm³(900SP with solvent); thermal resistance 0.013@10psi / 0.010℃・in²/W@40psi; volume resistivity ≥1.0×10¹³Ω・cm; dielectric constant ≥7@1KHz/1MHz.
- What are ordering specifications and storage conditions?
Forms: sheet, roll, die‑cut parts; 900SP paste available in cartridge / aluminum tube / jar; custom size ≤400400mm. Store at 15‑35℃, ≤65% RH, shelf‑life 12 months. Refer to MSDS (SDS) for safety instructions.
