Thermally Conductive Gel
Fill-Gel 1000
☑ Thermal Conductivity: 10.0W/m-K
☑ High reliability and thermal stability
☑ No post cure, easily for auto-dispensing
☑ Low siloxane content
☑ High compressibility for low stress applications
☑ Low contact resistance
☑ No pump-out, no crack/slide at thermal cycling and vibration environment
Datasheet
FAQ
- What is Fill Gel 1000?
Fill‑Gel 1000 is one‑component no‑cure silicone thermal gel with 10.0W/m・K thermal conductivity. High‑thixotropy for low‑stress gap filling, low siloxane, anti‑sag & anti‑crack. Suitable for high‑power devices, auto‑dispensable. Working temperature:‑50℃ ~ 200℃, UL94 V‑0.
- What applications is Fill Gel 1000 suitable for?
It targets high‑power scenarios: data‑center storage, telecom base stations, memory/power modules, smart terminals and devices requiring low assembly pressure.
- What are its main key parameters?
Grey; density 3.2g/cm³; flow rate 20g/min; min bondline 0.14mm; dielectric strength ≥5kV/mm; volume resistivity ≥1.0×10¹³Ω・cm.
- What are package and storage conditions?
Packages:30cc‑600cc cartridge, 5‑gallon pail. Seal‑store 0‑35℃, ≤65% RH, shelf‑life 12 months. Refer to MSDS for safety instructions.
