Thermally Conductive Gel
Fill-Gel 700
☑ Thermal Conductivity: 7.0W/m-K
☑ No post cure, easily dispensable and printable
☑ Good surface wetting and low stress
☑ High reliability and thermal stability
☑ No pump-out, no crack/slide at thermal cycling and vibration environment
Datasheet
FAQ
- What is Fill Gel 700?
Fill‑Gel 700 is one‑component fully‑cured silicone thermal gel with 7.0W/m・K thermal conductivity, no mixing or post‑curing. High thixotropy delivers low‑stress gap‑filling for multi‑components sharing one heat sink. It supports dispensing & stencil printing, reworkable, and outperforms thermal grease under cycling & vibration. Working temperature:‑50℃ ~ 200℃, UL94 V‑0.
- What are the typical applications of Fill Gel 700?
It applies to cooling modules, LED lighting, smart terminals, telecom base stations, memory & power modules and IGBT devices.
- What are the key physical, thermal and electrical properties of Fill Gel 700?
Grey color; density 2.5g/cm³; flow rate 45g/min (30cc EFD tube,2.5mm nozzle,90psi,60s); min bondline 0.05mm; thermal conductivity 7.0W/m・K; volume resistivity ≥1.0×10¹²Ω・cm.
- What are ordering specifications and storage requirements for Fill Gel 700?
Packages:30cc/50cc/100cc/180cc/300cc/600cc cartridge, 5‑gallon pail. Store sealed at 0‑35℃, ≤65% RH; shelf‑life 12 months. Do not ingest; refer to MSDS.
