Fill‑Gel 350G is one‑component fully‑cured silicone thermal gel with thermal conductivity of 3.5W/m・K, no mixing or secondary curing required. Featuring high thixotropy and soft flexibility, it fills gaps of different heights under low pressure and suits multi‑heat‑source components sharing one heat sink. Formulated for low‑stress application to protect sensitive electronic parts. It maintains long‑term wettability without drying‑out, resists cracking and sagging. It supports automatic dispensing, is rework‑friendly for on‑site repair and simplifies construction. Working temperature:‑50℃ ~ 200℃, UL94 V‑0 flammability rating.

It is widely used for chassis & cooling modules, LED lighting, smart terminals, mobile phones, tablet computers, communication equipment, SSD, new‑energy‑vehicle ECU controllers.

Light red color; density 3.2g/cm³; flow rate 22g/min (2.5mm nozzle,90psi,60s,30cc EFD tube); minimum bondline thickness 0.1mm; thermal conductivity 3.5W/m・K; dielectric strength ≥7kV/mm; volume resistivity ≥1.0×10¹³Ω・cm.

Package options: 30cc cartridge, 300cc cartridge, 5‑gallon pail. Storage: keep sealed, 0‑35℃, ≤65% RH; shelf‑life 12 months from the packing date. Do not ingest; keep away from children and combustion sources; refer to MSDS for full guidance.