Cured in Place Gap Filler
Fill-CIP 2120
☑ Thermal conductivity: 12.0W/m-K
☑ Easy for auto-dispensing
☑ Good surface wetting
☑ Good thixotropic
☑ High compressibility for low stress applications
☑ Excellent slump resistance and high shear thinning characteristics
☑ Good long-term reliability
Datasheet
FAQ
- What is Fill CIP 2120?
Fill‑CIP 2120 is 1:1 two‑component cure‑in‑place liquid gap filler, thermal conductivity 12.0W/m・K. Good thixotropy, shear‑thinning & anti‑slump for auto‑dispensing; room‑temperature curable, heat accelerates curing. Low‑stress, no excessive compression deformation above min BLT, high long‑term reliability. Working temperature:‑50℃ ~ 200℃, UL94 V‑0.
- What applications is Fill CIP 2120 suitable for?
It applies to automotive electronics & batteries, industrial‑LED lighting, power modules, large‑capacity data centers, consumer electronics and telecommunication equipment with variable uneven gaps.
- What are its main key parameters?
A:Dark Grey, B:Light Grey; mix ratio 1:1; pot‑life 2h@25℃; cure 48h@RT / 0.5h@120℃; post‑cure density 3.3g/cm³, hardness 65 Shore OO; min bondline 0.2mm; dielectric strength ≥6kV/mm; volume resistivity ≥1.0×10¹³Ω・cm.
- What are package and storage conditions?
Packages:25cc2, 200cc2, 600cc2 cartridge, 5‑gallon pail; fast/slow cure versions optional. Seal‑store 0‑35℃, ≤65% RH, shelf‑life 6 months. Refer to MSDS (SDS) for safety instructions.
