Cured in Place Gap Filler
Fill-CIP 220LD
☑ Thermal conductivity: 2.0W/m-K
☑ Low density: 2.0g/cm3
☑ Easy for auto-dispensing
☑ Low viscosity and good wetting
☑ Fast cured or adjustable cured profile
☑ High compressibility for low stress applications
☑ Good long-term reliability
Datasheet
FAQ
- What is Fill CIP 220LD?
Fill‑CIP 220LD is low‑density 1:1 two‑component cure‑in‑place liquid gap filler, thermal conductivity 2.0W/m・K. Low viscosity with good thixotropy for auto‑dispensing; cures at room temperature, heat accelerates curing. Low‑stress, lightweight formula, adjustable curing speed, good long‑term reliability. Working temperature:‑50℃ ~ 200℃, UL94 V‑0.
- What applications is Fill CIP 220LD suitable for?
It applies to automotive electronics & batteries, industrial & LED lighting, power modules, telecom equipment, consumer electronics and large‑scale data centers.
- What are its main key parameters?
A:Yellow, B:White; mix ratio 1:1; pot‑life 2h@25℃; cure 18h@25℃ / 0.5h@120℃; post‑cure density 2.0g/cm³, hardness 55 Shore OO; min bondline 0.12mm; dielectric strength ≥10kV/mm; volume resistivity ≥1.0×10¹³Ω・cm.
- What are package and storage conditions?
Packages:25cc2, 200cc2, 600cc2 cartridge, 5‑gallon pail; fast/slow cure versions optional. Seal‑store 0‑35℃, ≤65% RH, shelf‑life 6 months. Refer to MSDS for safety instructions.
