Cured in Place Gap Filler
Fill-CIP 220
☑ Thermal conductivity: 2.0W/m-K
☑ Easy for auto-dispensing
☑ Low viscosity and good wetting
☑ Low volatiles, Low siloxanes
☑ High compressibility for low stress applications
☑ Good long-term reliability
Datasheet
FAQ
- What is Fill CIP 220?
Fill‑CIP 220 is 1:1 two‑component cure‑in‑place liquid gap filler, thermal conductivity 2.0W/m・K. Low viscosity & good thixotropy for auto‑dispensing; cures at room temperature, heat accelerates curing. Low‑stress, ultra‑thin BLT, low siloxane with long‑term reliability. Working temperature:‑50℃ ~ 200℃, UL94 V‑0.
- What applications is Fill CIP 220 suitable for?
It applies to automotive electronics & batteries, LED lighting, telecom equipment, consumer electronics, data centers and power electronics.
- What are its main key parameters?
A:Yellow, B:White; mix ratio 1:1; pot‑life 2h@25℃; cure＜24h@25℃ / 0.5h@120℃; post‑cure density 2.9g/cm³, hardness 55 Shore OO; min bondline 0.06mm; dielectric strength ≥10kV/mm; volume resistivity ≥1.0×10¹³Ω・cm.
- What are package and storage conditions?
Packages:25cc2, 200cc2, 600cc2 cartridge, 5‑gallon pail; fast/slow cure versions optional. Seal‑store 0‑35℃, ≤65% RH, shelf‑life 6 months. Refer to MSDS for safety instructions.
