Thermally Conductive Grease
Fill-Grease 550
☑ Ultra-low thermal resistance
☑ Ultra-low BLT with a minimum of 20 μm
☑ Low viscosity, easy to use for fast and large area screen printing
☑ Thermal Conductivity: 5.5W/m-K
☑ Solventless formulation
Datasheet
FAQ
- What is Fill Grease 550?
Fill‑Grease 550 is high‑performance silicone‑based thermal grease, thermal conductivity 5.5W/m・K. Solvent‑free, good thixotropy, min BLT down to 20μm for ultra‑low thermal resistance. Supports dispensing & stencil/screen printing; no dry‑out and no pump‑out for long‑term reliability. Working temperature:‑40℃ ~ 125℃, UL94 V‑0.
- What applications is Fill Grease 550 suitable for?
It applies to cloud‑computing & storage servers, CPU/GPU chipset, telecom infrastructure, Northbridge chips, custom ASICs and IGBT modules.
- What are its main key parameters?
Grey color; density 2.87g/cm³; viscosity 171,000 cps; min bondline 20μm; thermal resistance 0.007℃・in²/W@40psi; volume resistivity ≥1.0×10¹²Ω・cm; dielectric constant＞10@1MHz.
- What are package and storage conditions?
Packages:30cc/50cc cartridge, 300cc aluminum tube, 1kg jar, 5‑gallon pail. Seal‑store 20‑35℃, ≤65% RH, shelf‑life 12 months. Refer to MSDS (SDS) for safety instructions.
