Liquid Metal
Fill-LM SP5000
☑ Extremely high thermal conductivity
☑ Ultra-low thermal resistance
☑ High reliability, no pump out/dry out in long term application
☑ High reliability, no pump out/dry out in long term application
☑ Safe and environmentally friendly, not volatile
☑ High temperature tolerance
☑ Compatible with all coolants in immersion environments
Datasheet
FAQ
- What is Fill LM SP5000?
Fill‑LM SP5000 is indium‑tin alloy liquid‑metal sheet thermal interface material, thermal conductivity ≥40W/m・K. With diamond or dot engraved surface pattern for good gap filling & ultra‑low contact thermal resistance. High‑temperature resistant, non‑volatile, compatible with immersion coolants, long‑term reliable without pump‑out or dry‑out.
- What applications is Fill LM SP5000 suitable for?
It applies to CPU/GPU chipset, LED & laser optical devices, servers, liquid‑cooling data centers, aerospace, military radar TR components, automotive electronics and test‑sorting equipment.
- What are its main key parameters?
Bright‑silver color; indium‑tin alloy; density 7.3g/cm³; thickness ≥0.15mm; thermal conductivity ≥40W/m・K; volume resistivity 8.4×10⁻⁸ Ω・m; available with diamond or round‑dot engraved patterns.
- What are ordering specifications and storage conditions?
Custom thickness ≥0.15mm, custom cut‑parts ≤400×400mm. Store at room temperature, keep away from light, ≤65% RH; unopened shelf‑life 6 months. Refer to MSDS (SDS) for safety instructions.
