Liquid Metal
Fill-LM S6000
☑ Extremely high thermal conductivity
☑ Ultra-low thermal resistance
☑ High reliability, no pump out/dry out in long term application
☑ Safe and environmentally friendly, not volatile
☑ High temperature tolerance
☑ Compatible with all coolants in immersion environments
Datasheet
FAQ
- What is Fill LM S6000?
Fill‑LM S6000 is bismuth‑based alloy liquid‑metal sheet thermal interface material, thermal conductivity ≥60W/m・K, melting point 60℃. Good ductility for excellent gap‑filling and ultra‑low contact thermal resistance. Non‑volatile, high‑temperature resistant, compatible with immersion coolants, no pump‑out or dry‑out for long‑term reliability. Working temperature:‑40℃ ~ 150℃.
- What applications is Fill LM S6000 suitable for?
It applies to CPU/GPU chipset, LED & laser optical devices, servers, liquid‑cooling data centers, aerospace, military radar TR components, automotive electronics and test‑sorting equipment.
- What are its main key parameters?
Bright‑silver color; bismuth‑based alloy; density 7.9g/cm³; thickness ≥0.05mm; melting point 60℃; thermal conductivity ≥60W/m・K; volume resistivity 8.3×10⁻⁸ Ω・m; sheet form.
- What are ordering specifications and storage conditions?
Custom thickness ≥0.05mm, custom cut‑parts ≤400×400mm. Store at room temperature, keep away from light, ≤65% RH; unopened shelf‑life 6 months. Refer to MSDS (SDS) for safety instructions.
