Liquid Metal
Fill-LM 820
☑ High thermal conductivity
☑ Ultra-low thermal resistance
☑ Good wetting, handling and reworking
☑ Good thixotropy, not flowable to avoid short circuit
☑ High reliability, no pump out/dry out, no crack/slump
☑ No corrosion of copper
Datasheet
FAQ
- What is Fill LM 820?
Fill‑LM 820 is polymer‑liquid‑metal composite thermal gel, thermal conductivity 8.0W/m・K. Low‑viscosity & good thixotropy, non‑flowing to avoid short‑circuit. Supports dispensing & printing, min bondline down to 10μm, anti pump‑out & anti‑phase‑separation, good reworkability. Working temperature:‑40℃ ~ 125℃.
- What applications is Fill LM 820 suitable for?
It applies to CPU, GPU, ASIC and other high‑performance chips, gaming servers, network switches and autopilot domain controllers.
- What are its main key parameters?
Grey color; density 5.0g/cm³; volatility ＜0.02%; min bondline 10μm; thermal conductivity 8.0W/m・K; thermal resistance 0.022℃・cm²/W@40psi. Good wetting on Si, stainless steel, Ni‑plated, anodized Al and Cu substrates.
- What are ordering specifications and storage conditions?
Packages: 20g/120g/500g tank, 30cc/100cc syringe. Sealed store at 15‑35℃, ≤65% RH, shelf‑life 6 months. Refer to MSDS (SDS) for safety instructions.
