Fill‑Pad HV800 is a high‑performance gap pad material with thermal conductivity of 8.0W/m・K, designed for high thermal performance requirements. It features low outgassing (D3‑D10 < 100ppm), low oil bleeding, good insulation, excellent surface wetting and lower thermal resistance, providing the right amount of residual stress for reliable interface adhesion and life‑cycle reliability. It is especially suitable for applications sensitive to siloxane volatiles. The standard grade is naturally tacky on both sides; non‑tacky treatment on one side is available for special applications. Working temperature:‑50℃ ~ 200℃, UL94 V‑0 rating.

It is widely used for telecommunications, wireless infrastructure & optical modules, LCD/PDP/laser TV monitors, industrial, LED lighting and power modules, automotive electronics, and HDD/SSD storage devices.

Light grey color; thickness range 0.5‑5.0mm; density 3.5g/cm³; hardness 60 Shore OO; thermal resistance 0.20℃・in²/W at 1mm@10psi; dielectric strength ≥7kV/mm. Thickness tolerance: ≥1mm ±10%; ＜1mm ±0.1mm. Custom cut parts within 457×457mm are available; optional A1 single‑sided tackified or NT1 single‑sided detackified versions.