Thermally Conductive Pad
Fill-Pad 300C
☑ Thermal Conductivity: 3.0W/m-K
☑ Good mechanical properties, high resilience, tension and bending resistance
☑ High breakdown voltage, excellent electrical insulation performance
☑ Low oil bleeding
☑ Naturally tacky or tack-free on one side available
☑ Good surface wetting
☑ High compressibility under low pressure
Datasheet
FAQ
- What is Fill Pad 300C?
Fill‑Pad 300C is a cost‑competitive thermally conductive gap pad made of silicone resin and thermally conductive fillers, with thermal conductivity of 3.0W/m・K. Its unique formula achieves minimal compression and residual stress on components while offering optimized surface wetting and low thermal resistance. The standard grade is naturally tacky on both sides; non‑tacky treatment on one side is available for special applications. Working temperature:‑50℃ ~ 200℃, UL94 V‑0 flammability rating.
- What are the typical applications of Fill Pad 300C?
It is widely used for automotive electronics and power batteries, electronic control units and domain controllers, capacitors/inductors/power modules, telecommunications and wireless infrastructure & network servers, LCD/PDP/laser TV displays, industrial & LED lighting, and HDD/SSD storage devices.
- What are the key thermal and electrical properties of Fill Pad 300C?
Thermal conductivity 3.0W/m・K; thermal resistance 0.50℃・in²/W at 1mm@10psi; dielectric strength ≥8kV/mm; dielectric constant 5.9@1MHz; volume resistivity ≥1.0×10¹³Ω・cm; low oil bleeding and high breakdown voltage provide excellent electrical insulation.
- What specifications are available when ordering Fill Pad 300C?
Thickness range: 0.5‑5.0mm, density 3.0g/cm³, hardness 50 Shore OO. Thickness tolerance: ≥1mm ±10%; ＜1mm ±0.1mm. Custom cut parts within 457×457mm are available. Optional A1 single‑sided tackified or NT1 single‑sided detackified versions; please inquire the available thickness before ordering.
- What safety precautions should be followed when using Fill Pad 300C?
Do not ingest. Store away from children and combustion sources. Keep the application interface clean. Please use in reference to MSDS for full guidance.
