Thermally Conductive Pad
Fill-Pad 200C
Datasheet
FAQ
- What is Fill Pad 200C?
Fill‑Pad 200C is a cost‑effective ceramic‑silicone composite thermally conductive gap pad with thermal conductivity of 2.0W/m・K. It features low compression & residual stress, good surface wetting and low thermal resistance, capable of fitting irregular surfaces to protect electronic components. The standard grade is naturally tacky on both sides; fiberglass‑reinforced version and NT1 single‑sided detackified option are available. Working temperature: ‑50℃ ~ 200℃, UL94 V‑0 flammability rating.
- What are the typical applications of Fill Pad 200C?
It is widely used for battery module & cooling plate heat dissipation, battery pack, automotive electronics, power supplies and charging pile inductor modules.
- What are the storage requirements and shelf life of Fill Pad 200C?
Store in an environment of 0‑35℃ and relative humidity ≤65% RH. The shelf life is 12 months from the packing date.
- What specifications are available when ordering Fill Pad 200C?
Thickness range: 0.5‑5.0mm. Thickness tolerance: ≥1mm ±10%; ＜1mm ±0.1mm. Custom cut parts within 457×457mm are available. Optional A1 single‑sided tackified or NT1 single‑sided detackified versions.
