Fill‑Pad US550 is a high‑performance ceramic‑filled silicone gap filler with thermal conductivity of 5.5W/m・K and high‑rebound properties. It maintains good mechanical strength, tension and bending resistance, with excellent surface wetting to lower interfacial thermal resistance and good handling integrity. It features extremely low oil bleeding and outstanding insulation performance, and can be single‑side coated with PI‑film for enhanced insulation, especially suitable for automotive industry. The standard grade is naturally tacky on both sides; NT1 single‑sided detackified option is available for special applications. Working temperature:‑50℃ ~ 200℃, UL94 V‑0 flammability rating.

It is widely used for automotive electronics & power batteries, electronic control units and domain controllers, capacitors, inductors and power modules, telecommunications & wireless infrastructure, network servers, LCD/PDP/laser TV displays, industrial & LED lighting, HDD & SSD storage devices.

Blue color; thickness range 0.5‑5.0mm, density 3.2g/cm³, hardness 50 Shore OO; outgassing TML 0.15%; thermal resistance 0.32℃・in²/W at 1mm@10psi; dielectric constant 6.8@1MHz; dielectric strength ≥8kV/mm; volume resistivity ≥1.0×10¹³Ω・cm.

Thickness tolerance: ≥1mm ±10%; ＜1mm ±0.1mm. Custom cut parts within 457×457mm are available. Optional A1 single‑sided tackified or NT1 single‑sided detackified versions. Storage: 0‑35℃, ≤65% RH; shelf‑life 12 months from the packing date. Do not ingest; keep away from children and combustion sources; keep bonding interface clean and refer to MSDS for full guidance.