Thermally Conductive Pad
Fill-Pad US450
Datasheet


FAQ
- What is Fill Pad US450?
Fill‑Pad US450 is a high‑performance ceramic‑filled silicone gap filler with thermal conductivity of 4.5W/m・K and high resilience. It features good mechanical strength, tension & bending resistance, excellent surface wetting for low interfacial thermal resistance, low oil bleeding and superior electrical insulation. It can be single‑side coated with PI‑film for enhanced insulation, and is especially suitable for automotive industry. The standard grade is naturally tacky on both sides; NT1 single‑sided detackified option is available for special applications. Working temperature:‑50℃ ~ 200℃, UL94 V‑0 flammability rating.
- What are the typical applications of Fill Pad US450?
It is widely used for automotive electronics & power batteries, electronic control units and domain controllers, capacitors, inductors and power modules, telecommunications & wireless infrastructure, network servers, LCD/PDP/laser TV displays, industrial & LED lighting, HDD & SSD storage devices.
- What are the key physical, thermal and electrical properties of Fill Pad US450?
Light yellow color; thickness range 0.5‑5.0mm, density 3.1g/cm³, hardness 50 Shore OO; outgassing TML 0.17%; thermal resistance 0.46℃・in²/W at 1mm@10psi; dielectric constant 6.5@1MHz; dielectric strength ≥8kV/mm; volume resistivity ≥1.0×10¹³Ω・cm.
- What are ordering specifications and storage requirements for Fill Pad US450?
Thickness tolerance: ≥1mm ±10%; <1mm ±0.1mm. Custom cut parts within 457×457mm are available. Optional A1 single‑sided tackified or NT1 single‑sided detackified versions. Storage: 0‑35℃, ≤65% RH; shelf‑life 12 months from the packing date. Do not ingest; keep away from children and combustion sources; keep bonding interface clean and refer to MSDS for full guidance.










