Fill‑Pad SF1000 is a high‑performance gap filler material made of non‑silicone resin and thermally conductive fillers, with thermal conductivity of 10.0W/m・K. Its unique formula achieves good mechanical properties and high resilience, optimized surface wetting and low thermal resistance. It features low outgassing and low oil bleeding and contains no small silicone molecules, especially suitable for electronic applications sensitive to silicone volatiles. Working temperature:‑40℃ ~ 125℃, UL94 V‑0 rating.

It is widely used for camera modules, telecommunications & wireless infrastructure & network servers, optical modules, automotive electronics, industrial & LED lighting and power modules, LCD/PDP/laser TV displays, HDD & SSD storage devices.

Available models: SF1000‑60H and SF1000‑40H. Both share: light grey color, thickness range 0.5‑5.0mm, density 3.5g/cm³, hardness 60 Shore OO; outgassing TML ＜0.10%; thermal resistance 0.204℃・in²/W at 1mm@10psi; dielectric strength ≥7kV/mm; volume resistivity ≥1.0×10¹³Ω・cm.

Thickness tolerance: ≥1mm ±10%; ＜1mm ±0.1mm. Custom cut parts within 457×457mm are available. Optional A1 single‑sided tackified or NT1 single‑sided detackified versions. Storage: 0‑35℃, ≤65% RH; shelf‑life 12 months from the packing date. Do not ingest; keep away from children and combustion sources; keep bonding interface clean and refer to MSDS.