Thermally Conductive Pad
Fill-Pad SF800
Datasheet
FAQ
- What is Fill Pad SF800?
Fill‑Pad SF800 is a high‑performance gap filler made of non‑silicone resin and thermal conductive fillers, with thermal conductivity of 8.0W/m・K. It has good mechanical properties and high resilience, optimized surface wetting and low thermal resistance. Silicone‑free without silicone contamination, it features low outgassing and low oil bleeding, especially suitable for electronic applications sensitive to silicone volatiles. Working temperature:‑40℃ ~ 125℃, UL94 V‑0 flammability rating.
- What are the typical applications of Fill Pad SF800?
It is widely used for optical modules, telecommunications & wireless infrastructure, network servers, automotive electronics, industrial & LED lighting and power modules, LCD/PDP/laser TV displays, HDD & SSD storage devices.
- What are the key physical, thermal and electrical properties of Fill Pad SF800?
Light grey color; thickness range 0.5‑5.0mm; density 3.35g/cm³; hardness 50 Shore OO; outgassing TML 0.10%; thermal resistance 0.132℃・in²/W at 1mm@10psi; dielectric strength ≥7kV/mm; volume resistivity ≥1.0×10¹³Ω・cm.
- What are ordering specifications and storage requirements for Fill Pad SF800?
Thickness tolerance: ≥1mm ±10%; ＜1mm ±0.1mm. Custom cut parts within 457×457mm are available. Optional A1 single‑sided tackified or NT1 single‑sided detackified versions. Storage: 0‑35℃, ≤65% RH; shelf‑life 12 months from the packing date. Do not ingest; keep away from children and combustion sources; keep bonding interface clean and refer to MSDS for full guidance.
