Fill‑Pad SF310 is a high‑performance gap filler made of polyurethane resin and thermal conductive fillers, with thermal conductivity of 3.0W/m・K. It delivers good mechanical properties and high resilience, optimized surface wetting and low thermal resistance. Being silicone‑free without silicone contamination, it features low outgassing and low oil bleeding, especially suitable for electronic devices sensitive to silicone volatiles. Working temperature:‑40℃ ~ 125℃, UL94 V‑0 flammability rating.

It is widely used for camera modules, telecommunications & wireless infrastructure, network servers, optical modules, automotive electronics, industrial & LED lighting and power modules, LCD/PDP/laser TV displays, HDD & SSD storage devices.

Light pink color; thickness range 0.5‑5.0mm; density 3.0g/cm³; hardness 55 Shore OO; outgassing TML 0.10%; thermal resistance 0.48℃・in²/W at 1mm@10psi; dielectric strength ≥8kV/mm; volume resistivity ≥1.0×10¹³Ω・cm.

Thickness tolerance: ≥1mm ±10%; ＜1mm ±0.1mm. Custom cut parts within 457×457mm are available. Optional A1 single‑sided tackified or NT1 single‑sided detackified versions. Storage: 0‑35℃, ≤65% RH; shelf‑life 12 months from the packing date. Do not ingest; keep away from children and combustion sources; keep bonding interface clean and refer to MSDS for full guidance.