Thermally Conductive Pad
Fill-Pad 810
Datasheet
FAQ
- What is Fill Pad 810?
Fill‑Pad 810 is an ultra‑thin gap filler material with thermal conductivity of 8.0W/m・K, featuring good surface wetting and high flexibility. Designed for thin‑gap interfaces, it is glass‑fiber‑free while maintaining good mechanical properties for easy assembly handling. It has low volatility and low oil bleeding; its special formula prevents powder or glue shedding. Free of metal powders in formulation, it delivers high dielectric strength. The standard grade is naturally tacky on both sides; A1 single‑sided tackified or NT1 single‑sided detackified options are available for special applications. Working temperature:‑50℃ ~ 200℃, UL94 V‑0 flammability rating.
- What are the typical applications of Fill Pad 810?
It is widely used for optical modules, telecommunications & wireless infrastructure, network servers, automotive electronics, industrial & LED lighting and power modules, LCD/PDP/laser TV displays, HDD & SSD storage devices.
- What are the key physical, thermal and electrical properties of Fill Pad 810?
Grey color; thickness range 0.3‑1.0mm, density 3.5g/cm³, hardness 55 Shore OO; outgassing TML 0.10%; thermal resistance 0.11℃・in²/W at 0.5mm@10psi; dielectric constant 8.1@1MHz; dielectric strength ≥7kV/mm; volume resistivity ≥1.0×10¹³Ω・cm.
- What are ordering specifications and storage requirements for Fill Pad 810?
Thickness tolerance: ≥1mm ±10%; ＜1mm ±0.1mm. Custom cut parts within 457×457mm are available. Optional A1 single‑sided tackified or NT1 single‑sided detackified versions. Storage: 0‑35℃, ≤65% RH; shelf‑life 12 months from the packing date. Do not ingest; keep away from children and combustion sources; keep bonding interface clean and refer to MSDS for full guidance.
