Thermally Conductive Pad
Fill-Pad P300
Datasheet
FAQ
- What is Fill Pad P300?
Fill‑Pad P300 is a single‑sided thermally conductive silicone rubber compound with PI film as substrate, thermal conductivity of 3.0W/m・K. It features ultra‑soft property, high compressibility under low pressure, high insulation, abrasion, tear and puncture resistance, with low compression & residual stress and good surface wetting to minimize interfacial thermal impedance. Working temperature:‑50℃ ~ 200℃, UL94 V‑0 flammability rating.
- What are the typical applications of Fill Pad P300?
It is widely used for telecommunications & wireless infrastructure, network servers, optical modules, automotive electronics, industrial & LED lighting and power modules, LCD/PDP/laser TV displays, HDD & SSD storage devices.
- What are key specifications, ordering and storage requirements for Fill Pad P300?
Yellow color; thickness range 0.5‑5.0mm, density 3.1g/cm³, hardness 20 Shore OO; thermal resistance 0.48℃・in²/W at 1mm@10psi; dielectric strength ≥8kV/mm. Thickness tolerance: ≥1mm ±10%; ＜1mm ±0.1mm. Custom cut parts within 457×457mm are available; optional A1 single‑sided tackified or NT1 single‑sided detackified versions. Storage: 0‑35℃, ≤65% RH; shelf‑life 12 months from the packing date.
