Thermally Conductive Pad
Fill-Pad LV300
Datasheet
FAQ
- What is Fill Pad LV300?
Fill‑Pad LV300 is a high‑performance gap filler material with thermal conductivity of 3.0W/m・K. It delivers minimal compression and residual stress on components, good surface wetting and low thermal resistance. Featuring low outgassing and low oil bleeding with siloxane content ∑D₃‑D₁₀ ＜100 ppm, it is especially suitable for optical devices. The standard grade is naturally tacky on both sides; NT1 single‑sided detackified option is available for special applications. Working temperature:‑50℃ ~ 200℃, UL94 V‑0 flammability rating.
- What are the typical applications of Fill Pad LV300?
It is widely used for optical modules, telecommunications & wireless infrastructure, network servers, automotive electronics, industrial & LED lighting and power modules, LCD/PDP/laser TV displays, HDD & SSD storage devices.
- What specifications and ordering options are available for Fill Pad LV300?
Red color; thickness range 0.5‑5.0mm, density 3.1g/cm³, hardness 40 Shore OO; thermal resistance 0.45℃・in²/W at 1mm@10psi, dielectric strength ≥8kV/mm. Thickness tolerance: ≥1mm ±10%; ＜1mm ±0.1mm. Custom cut parts within 457×457mm are available. Optional A1 single‑sided tackified or NT1 single‑sided detackified versions. Storage: 0‑35℃, ≤65% RH; shelf‑life 12 months from the packing date.
