Thermally Conductive TPM
Fill-TPM 800
☑ Extremely low thermal resistance
☑ Silicone free, no silicone contamination
☑ High reliability, no pump out/dry out/crack/slump in long term application
☑ Superior self-healing capability, effectively mitigating pump-out induced by warpage of large-sized chips
☑ Good handling and reworkability
☑ Soft at room temperature, less stress on board during assembly
Datasheet
FAQ
- What is Fill TPM 800?
Fill‑TPM 800 is a silicone‑free ultra‑thin thermal interface material with 8.0 W/m‑K thermal conductivity. Soft at room temperature, low assembly stress on board, good handling and reworkability, available as sheet, roll and die‑cut parts.
- What are its typical applications?
It is suitable for CPU, GPU, ASIC, LPU and other chipsets, automotive domain controllers, gaming laptops and laser devices.
- What are the key performance parameters?
Grey color; thickness 0.15~0.50 mm; density 2.8 g/cm³; min bondline 25 μm; working temperature ‑40~125 ℃; thermal resistance 0.014 ℃・in²/W@10psi/70 ℃, 0.007 @40psi/70 ℃; volume resistivity ≥1.0×10¹² Ohm‑cm; dielectric constant>10@1kHz/1MHz; UL94 V‑0. Typical values only for reference.
- What reliability advantages does it offer?
No pump‑out /dry‑out /crack/slump in long term; superior self‑healing mitigates pump‑out caused by warpage of large‑size chips; stable thermal resistance after aging, thermal shock and 85℃/85% RH tests; no silicone contamination.
- What are ordering options and storage requirements?
Sheet, roll and die‑cut parts; custom size ≤400×400 mm. Seal‑store at 15~35 ℃, ≤65% RH, protected from compression; shelf‑life 12 months from packing date.
