Cured in Place Gap Filler
Fill-CIP 1120
☑ Good surface wetting
Datasheet
FAQ
- What is Fill CIP 1120?
Fill‑CIP 1120 is single‑part heat‑cure silicone gap filler filled with ceramic powder. It features 12.0 W/m‑K thermal conductivity, high thixotropy, low oil‑bleeding, minimum BLT＜0.19 mm, UL94 V‑0. It supports automatic dispensing for uneven‑gap components.
- What are its typical application fields?
It is suitable for optical modules, telecom equipment, automotive electronics, domain controllers and LED lighting, good for components requiring low‑stress protection.
- What are the key performance parameters?
Working temperature‑50~200 °C；curing＜30 min @120 °C；operational time＞48 h；volume resistivity ≥1.0×10¹³ Ohm‑cm；dielectric strength ≥6 kV/mm. Typical values only for reference.
- What are ordering options and storage requirements?
Available in 30 cc、300 cc、600 cc cartridges and 5‑gallon pail. Seal and store below 5 °C, shelf‑life 12 months from packing date.
- What are its reliability advantages?
Low out‑gassing and low oil bleeding; resistant to pump‑out under vibration & vertical mounting; stable thermal performance after high‑temp aging, thermal shock and 85℃/85% RH damp‑heat test.
