Cured in Place Gap Filler
Fill-CIP 235
☑ Thermal Conductivity: 1.5W/m-K
☑ Naturally tacky or tack-free on one side available
☑ Good surface wetting
☑ High compressibility under low pressure
☑ High flexibility
Datasheet
FAQ
- What is Fill CIP 235?
Fill‑CIP 235 is 1:1 two‑component cure‑in‑place liquid gap filler, thermal conductivity 3.5W/m・K. Low viscosity and good thixotropy for auto‑dispensing; room‑temperature curable, heat can speed up curing. Low‑stress, adjustable curing speed, excellent long‑term reliability.
Working temperature:‑50℃ ~ 200℃, UL94 V‑0.
- What applications is Fill CIP 235 suitable for?
It applies to automotive electronics & batteries, industrial‑LED lighting, power modules, telecom equipment, consumer electronics and large‑capacity data centers.
- What are its main key parameters?
A:White, B:Blue; mix ratio 1:1; pot‑life 2h@25℃; cure 18h@25℃ / 0.5h@120℃; post‑cure density 3.1g/cm³, hardness 50 Shore OO; min bondline 0.1mm; dielectric strength ≥10kV/mm; volume resistivity ≥1.0×10¹³Ω・cm.
- What are package and storage conditions?
Packages:25cc2, 200cc2, 600cc2 cartridge, 5‑gallon pail; fast/slow cure versions optional. Seal‑store 0‑35℃, ≤65% RH, shelf‑life 6 months. Refer to MSDS for safety instructions.
