Curable Thermally Conductive Gel
Fill-CIP 235LV
☑ Thermal conductivity: 3.5W/m-K
☑ Easy for auto-dispensing
☑ Low viscosity and good wetting
☑ Low volatiles, Low siloxanes
☑ High compressibility for low stress applications
☑ Good long-term reliability
Datasheet
FAQ
- What is Fill CIP 235LV?
Fill‑CIP 235LV is low‑volatile 1:1 two‑component cure‑in‑place liquid gap filler, thermal conductivity 3.5W/m・K. Low viscosity & good thixotropy for auto‑dispensing; room‑temperature curable, heat accelerates curing. Low‑siloxane, low‑stress, suitable for outgassing‑sensitive optical devices. Working temperature:‑50℃ ~ 200℃, UL94 V‑0.
- What applications is Fill CIP 235LV suitable for?
It applies to automotive electronics & batteries, industrial‑LED lighting, power modules, data centers, consumer electronics and telecommunication equipment especially optical‑related devices.
- What are its main key parameters?
A:White, B:Red; mix ratio 1:1; pot‑life 2h@25℃; cure 18h@25℃ / 0.5h@120℃; post‑cure density 3.1g/cm³, hardness 50 Shore OO; ∑D₃‑D₁₀＜50 ppm; min bondline 0.13mm; dielectric strength ≥10kV/mm; volume resistivity ≥1.0×10¹³Ω・cm.
- What are package and storage conditions?
Packages:25cc2, 200cc2, 600cc2 cartridge, 5‑gallon pail; fast/slow cure versions optional. Seal‑store 0‑35℃, ≤65% RH, shelf‑life 6 months. Refer to MSDS for safety instructions.
