Fill‑Gel 450 is a one‑component fully‑cured silicone thermal gel with thermal conductivity of 4.5W/m・K, no mixing or post‑curing required. Featuring high thixotropy and flexibility, it fills gaps with different heights under low pressure and fits scenarios where multiple heat‑generating components share one heat sink. Its unique formula delivers minimal compression stress on components, excellent surface wetting and low thermal resistance. Cross‑linked gel structure provides superior long‑term reliability versus traditional thermal grease under thermal cycling, shock and vibration. It supports automatic dispensing and stencil printing, and is reworkable for on‑site repair. Working temperature:‑50℃ ~ 200℃, UL94 V‑0 flammability rating.

It is widely used for data centers, mining equipment, servers, switches, optical modules, LED lighting, IGBT, automotive components, smart terminals, mobile phones, tablet computers, communication equipment and memory modules.

Green color; density 3.25g/cm³; flow rate 50g/min (30cc EFD tube, 2.5mm nozzle, 90psi,60s); minimum bondline thickness 0.06mm; thermal conductivity 4.5W/m・K; dielectric strength ≥6kV/mm; volume resistivity ≥1.0×10¹³Ω・cm.

Package options: 30cc, 50cc, 100cc, 180cc, 300cc, 600cc cartridge, 5‑gallon pail. Storage: keep sealed, 0‑35℃, ≤65% RH; shelf‑life 12 months from the packing date. Do not ingest; keep away from children and combustion sources; refer to MSDS for full guidance.