Thermally Conductive Pad
Fill-Pad 150
☑ Thermal Conductivity: 1.5W/m-K
☑ Naturally tacky or tack-free on one side available
☑ Good surface wetting
☑ High compressibility under low pressure
☑ High flexibility
Datasheet
FAQ
- What is Fill Pad 150?
Fill‑Pad 150 is an ultra‑soft ceramic‑silicone composite gap filler with thermal conductivity of 1.5W/m・K. It features high compressibility under low pressure, excellent resilience and good surface wetting, bringing low compression stress to components. The standard version is naturally tacky on both sides; NT1 single‑sided detackified option is available. Working temperature: ‑50℃ ~ 200℃, UL94 V‑0 flammability rating.
- What are the typical applications of Fill Pad 150?
It is suitable for semiconductor heat sinks, telecommunication hardware, smart terminals, LED lighting and power conditioning & conversion systems.
- What are storage rules and ordering specifications for Fill Pad 150?
Storage: 0‑35℃, ≤65% RH, shelf life 12 months from the packing date. Ordering: thickness range 0.5‑5.0mm; tolerance ≥1mm ±10%, ＜1mm ±0.1mm. Custom cut parts within 457×457mm; optional A1 single‑sided tackified or NT1 single‑sided detackified versions.
