Fill‑Pad 500C is a cost‑competitive, high‑performance thermally conductive gap filler combining 5.0W/m・K thermal conductivity with high resilience. It maintains good mechanical strength, tension and bending resistance, offers excellent surface wetting to minimize interface thermal resistance, and features extremely low oil bleeding. The standard grade is naturally tacky on both sides; non‑tacky treatment on one side is available for special applications. It is especially suitable for the automotive industry.

It is widely used for automotive electronics and power batteries, electronic control units and domain controllers, capacitors/inductors/power modules, telecommunications and wireless infrastructure & network servers, LCD/PDP/laser TV displays, industrial & LED lighting, and HDD/SSD storage devices.

Two types are offered: H30 (hardness 30 Shore OO, grey) and H50 (hardness 50 Shore OO, blue), both with thickness range 0.5‑5.0mm and density 3.2g/cm³. Thickness tolerance: ≥1mm ±10%; ＜1mm ±0.1mm. Custom cut parts within 457×457mm are available; optional A1 single‑sided tackified or NT1 single‑sided detackified versions.

Store at 0‑35℃ with relative humidity ≤65% RH; shelf life is 12 months from the packing date. Do not ingest. Keep away from children and combustion sources. Keep the application interface clean and refer to MSDS for full guidance.