Thermally Conductive Pad
Fill-Pad 800A
Datasheet
FAQ
- What is Fill-Pad 800A?
Fill-Pad 800A is a high-performance ceramic-silicone composite gap filler with thermal conductivity of 8.0W/m・K. It has high compressibility under low pressure, supports automated assembly, features low oil bleeding and low outgassing. Standard grade is naturally tacky on both sides.
- What are the typical applications of Fill-Pad 800A?
It is widely used for 5G communication base stations, network servers, GPU modules, optical transceivers, display devices, industrial LED lighting, HDD & SSD storage devices.
- What are the storage requirements and shelf life of Fill-Pad 800A?
Store in environment of 0~35℃ and relative humidity ≤65% RH. The shelf life is 12 months from the packing date.
- What specifications are available when ordering Fill-Pad 800A?
Thickness range:0.5~5.0mm. Thickness tolerance: ≥1mm ±10%; ＜1mm ±0.1mm. Custom cut parts (<457*457mm) are available. Optional A1 single-sided tackified or NT1 single-sided detackified versions.
