Fill‑Pad LDK600 is a high‑performance gap filler material with thermal conductivity of 6.0W/m・K, featuring good surface wetting and excellent mechanical properties. Made of BN‑filled silicone sheet, it delivers low dielectric constant and high insulation. Good flexibility enables low thermal resistance; it can conform to uneven or irregular component surfaces to fully fill gaps between heat‑generating parts and heat sinks/boards/chassis. It also provides vibration absorption and stress‑reduction performance to protect electronic devices. The standard grade is naturally tacky on both sides; A1 single‑sided tackified or NT1 single‑sided detackified options are available for special applications. Working temperature:‑45℃ ~ 200℃, UL94 HB flammability rating.

It is widely used for semiconductor equipment, microwave components, 5G base stations, RF modules for mobile devices and WiFi module chips.

White color; thickness range 0.25‑1.0mm, density 1.5g/cm³, hardness 70 Shore OO; outgassing TML 0.07%, CVCM 0.02%; thermal resistance 0.32℃・in²/W @0.5mm@10psi, 0.27℃・in²/W @0.5mm@40psi; dielectric constant 3.2@1MHz; dielectric strength 8.0kV/mm; volume resistivity ≥2.0×10¹³Ω・cm.

Thickness tolerance: ≥1mm ±10%; ＜1mm ±0.1mm. Custom cut parts within 457×457mm are available. Optional A1 single‑sided tackified or NT1 single‑sided detackified versions. Storage: 0‑35℃, ≤65% RH; shelf‑life 12 months from the packing date. Do not ingest; keep away from children and combustion sources; keep bonding interface clean and refer to MSDS for full guidance.