Fill‑Pad LV600 is a high‑performance gap filler material combining 6.0W/m・K thermal conductivity with excellent pressure‑vs‑deflection characteristics. It achieves minimal compression and residual stress on components, with optimized surface wetting and low thermal resistance, reducing mechanical and thermal stress in devices. It features low outgassing and siloxane content ΣD₃‑D₁₀ ＜100ppm, especially suitable for optical devices. The standard grade is naturally tacky on both sides; non‑tacky treatment on one side is available for special applications. Working temperature:‑50℃ ~ 200℃, UL94 V‑0 rating.

It is widely used for optical modules, telecommunications & wireless infrastructure & network servers, automotive electronics, industrial, LED lighting and power modules, LCD/PDP/laser TV displays, and HDD/SSD storage devices.

Dark grey color; thickness range 0.5‑5.0mm; density 3.4g/cm³; hardness 50 Shore OO; outgassing TML 0.06% and CVCM 0.02%; thermal resistance 0.28℃・in²/W at 1mm@10psi; dielectric strength ≥7kV/mm; volume resistivity ≥1.0×10¹³Ω・cm.

Thickness tolerance: ≥1mm ±10%; ＜1mm ±0.1mm. Custom cut parts within 457×457mm are available; optional A1 single‑sided tackified or NT1 single‑sided detackified versions. Storage: 0‑35℃, ≤65% RH; shelf life 12 months from the packing date. Do not ingest; keep away from children and combustion sources; keep the application interface clean and refer to MSDS.