Fill‑Pad LV800 is a high‑performance gap filler material with thermal conductivity of 8.0W/m・K and excellent pressure‑vs‑deflection characteristics. It delivers minimal compression and residual stress on components, good surface wetting and low thermal resistance to reduce mechanical and thermal stress inside devices. It features low outgassing with siloxane content ∑D₃‑D₁₀ ＜100 ppm, especially suitable for volatile‑sensitive optical components. The standard grade is naturally tacky on both sides; NT1 single‑sided detackified option is available for special applications. Working temperature:‑50℃ ~ 200℃, UL94 V‑0 flammability rating.

It is widely used for optical modules, telecommunications & wireless infrastructure, network servers, automotive electronics, industrial, LED lighting and power modules, LCD/PDP/laser TV displays, HDD & SSD storage devices.

Light grey color; thickness range 0.5‑5.0mm, density 3.5g/cm³, hardness 50 Shore OO; outgassing TML 0.08%, CVCM 0.02%; thermal resistance 0.25℃・in²/W at 1mm@10psi; dielectric strength ≥7kV/mm; volume resistivity ≥1.0×10¹³Ω・cm.

Thickness tolerance: ≥1mm ±10%; ＜1mm ±0.1mm. Custom cut parts within 457×457mm are available. Optional A1 single‑sided tackified or NT1 single‑sided detackified versions. Storage: 0‑35℃, ≤65% RH; shelf‑life 12 months from the packing date. Do not ingest, keep away from children and combustion sources; keep bonding interface clean and refer to MSDS for full guidance.