Thermally Conductive Pad
Fill-Pad P311
Datasheet
FAQ
- What is Fill Pad P311?
Fill‑Pad P311 is a single‑sided thermally conductive silicone rubber compound with PI‑film substrate, thermal conductivity of 4.0W/m・K. It features thin‑thickness design, low thermal resistance, high insulation, excellent wear, tear and puncture resistance. Its surface is smooth and non‑sticky for convenient automated production, suitable for MOSFET, IGBT and SiC modules. Working temperature:‑50℃ ~ 200℃, UL94 V‑0 flammability rating.
- What are the typical applications of Fill Pad P311?
It is widely used for battery module & cooling plate heat dissipation, battery pack, automotive electronics, power supply and power conversion equipment, MOSFET, IGBT and SiC modules.
- What are the key physical, thermal and electrical properties of Fill Pad P311?
Light blue color; smooth and non‑sticky surface; thickness range 0.3‑0.5mm; density 3.0g/cm³; hardness 35 Shore A; outgassing TML 0.13%; thermal resistance 0.53℃・in²/W at 0.3mm@10psi; dielectric strength＞6kV/mm (0.3mm); volume resistivity ≥1.0×10¹³Ω・cm.
- What are ordering specifications and storage requirements for Fill Pad P311?
Thickness tolerance: ≥1mm ±10%; ＜1mm ±0.1mm. Custom cut parts within 457×457mm are available. Optional A1 single‑sided tackified or NT1 single‑sided detackified versions. Storage: 0‑35℃, ≤65% RH; shelf‑life 12 months from the packing date. Do not ingest; keep away from children and combustion sources; keep bonding interface clean and refer to MSDS for full guidance.
