Fill‑Pad US1400 is a high‑performance gap pad material with thermal conductivity of 14.0W/m・K, designed for high thermal performance requirements. Its unique formula operates without glass‑fibre reinforcement even at thicknesses below 1mm. It features low volatility, low oil bleeding and high insulation, good surface wetting and lower thermal resistance, providing the right amount of residual stress to maintain good interface adhesion and ensure life‑cycle reliability. The standard grade is naturally tacky on both sides; NT1 single‑sided detackified option is available for special applications. Working temperature:‑40℃ ~ 125℃, UL94 V‑0 flammability rating.

It is widely used for telecommunications, wireless infrastructure & optical modules, LCD/PDP/laser TV monitors, industrial, LED lighting and power modules, automotive electronics, HDD & SSD storage devices.

Grey color; thickness range 0.3‑5.0mm, density 3.2g/cm³; hardness 60 Shore OO (<1.0mm) / 45 Shore OO (≥1.0mm); outgassing TML 0.1%; thermal resistance 0.09℃・in²/W at 1mm@10psi; dielectric constant 7.8@1MHz; dielectric strength ≥7kV/mm; volume resistivity ≥1.0×10¹³Ω・cm.

Thickness tolerance: ≥1mm ±10%; ＜1mm ±0.1mm. Custom cut parts within 457×457mm are available. Optional A1 single‑sided tackified or NT1 single‑sided detackified versions. Storage: 0‑35℃, ≤65% RH; shelf‑life 12 months from the packing date. Do not ingest; keep away from children and combustion sources; keep bonding interface clean and refer to MSDS for full guidance.