Thermally Conductive Pad
Fill-Pad US600
☑ High flexibility
Datasheet
FAQ
- What is Fill Pad US600?
Fill‑Pad US600 is a high‑performance ceramic‑filled silicone gap filler with thermal conductivity of 6.0W/m・K and excellent pressure‑vs‑deflection characteristics. It achieves minimal compression and residual stress on components, good surface wetting and low contact resistance to reduce mechanical and thermal stress inside devices. The standard grade is naturally tacky on both sides; NT1 single‑sided detackified option is available for special applications. Working temperature:‑50℃ ~ 200℃, UL94 V‑0 flammability rating.
- What are the typical applications of Fill Pad US600?
It is widely used for automotive electronics, telecommunications & wireless infrastructure, memory modules & SSD, industrial & LED lighting and power modules, LCD/PDP/laser TV displays.
- What are the key physical, thermal and electrical properties of Fill Pad US600?
Dark grey color; thickness range 0.5‑5.0mm, density 3.4g/cm³, hardness 40 Shore OO; outgassing TML 0.15%; thermal resistance 0.20℃・in²/W at 1mm@10psi; dielectric constant 8.1@1MHz; dielectric strength ≥7kV/mm; volume resistivity ≥1.0×10¹³Ω・cm.
- What are ordering specifications and storage requirements for Fill Pad US600?
Thickness tolerance: ≥1mm ±10%; ＜1mm ±0.1mm. Custom cut parts within 457×457mm are available. Optional A1 single‑sided tackified or NT1 single‑sided detackified versions. Storage: 0‑35℃, ≤65% RH; shelf‑life 12 months from the packing date. Do not ingest; keep away from children and combustion sources; keep bonding interface clean and refer to MSDS for full guidance.
