Fill‑Pad US800 is a high‑performance ceramic‑filled silicone gap pad with thermal conductivity of 8.0W/m・K and high compressibility under low pressure. Designed for high‑power and high‑heat applications, it delivers low compression force to accommodate large dimensional tolerances and multiple‑gap conditions, with low compression stress and minimal residual stress on components. It features good surface wetting, low oil bleeding and low outgassing with ∑D₃‑D₁₀ ＜100 ppm, especially suitable for siloxane‑volatile‑sensitive applications. The standard grade is naturally tacky on both sides; NT1 single‑sided detackified option is available for special applications. Working temperature:‑50℃ ~ 200℃, UL94 V‑0 flammability rating.

It is widely used for telecommunications & wireless infrastructure, network servers, optical modules, automotive electronics, HDD & SSD storage devices, industrial & LED lighting and power modules.

Light grey color; thickness range 0.5‑5.0mm, density 3.5g/cm³, hardness 35 Shore OO; outgassing TML 0.14%; thermal resistance 0.19℃・in²/W at 1mm@10psi; dielectric constant 8.3@1MHz; dielectric strength ≥7kV/mm; volume resistivity ≥1.0×10¹³Ω・cm.

Thickness tolerance: ≥1mm ±10%; ＜1mm ±0.1mm. Custom cut parts within 457×457mm are available. Optional A1 single‑sided tackified or NT1 single‑sided detackified versions. Storage: 0‑35℃, ≤65% RH; shelf‑life 12 months from the packing date. Do not ingest; keep away from children and combustion sources; keep bonding interface clean and refer to MSDS for full guidance.