Fill‑Pad UT300 is an ultra‑thin gap filler material with thermal conductivity of 3.0W/m・K, featuring excellent thermal performance and high flexibility. Designed for thin‑gap interfaces, it adopts non‑glass‑fiber substrate and maintains good mechanical properties for easy assembly handling. It is ideal for low‑voltage applications and thermal solutions for handheld devices under space‑limited conditions, delivering high insulation and reliable performance. The standard grade is naturally tacky on both sides; A1 single‑sided tackified or NT1 single‑sided detackified options are available for special applications. Working temperature:‑50℃ ~ 200℃, UL94 V‑0 flammability rating.

It is widely used for mobile devices including cell phones, laptops and game consoles, ultra‑thin notebooks, consumer electronics, LED lighting, automotive electronics and wireless routers.

Grey color; thickness range 0.2‑0.5mm, density 3.1g/cm³, hardness 65 Shore OO; outgassing TML 0.18%; thermal resistance 0.23℃・in²/W at 0.4mm@10psi; dielectric constant 5.5@1MHz; dielectric strength ≥7kV/mm; volume resistivity ≥1.0×10¹³Ω・cm.

Thickness tolerance: ≥1mm ±10%; ＜1mm ±0.1mm. Custom cut parts within 457×457mm are available. Optional A1 single‑sided tackified or NT1 single‑sided detackified versions. Storage: 0‑35℃, ≤65% RH; shelf‑life 12 months from the packing date. Do not ingest; keep away from children and combustion sources; keep bonding interface clean and refer to MSDS for full guidance.